Akademik Məlumat İdarəetmə Sistemi
Proceedings of SPIE - The International Society for Optical Engineering, vol.3819, pp.209-212, 1999 (Scopus)
The resistance of transient contacts of the extruded samples of Bi85Sb15 solid solution with contact alloy was measured by probe method on alternating current. At the fixing of contact on torahs of extruded samples, a mutual diffusion of components of solid solution and contact alloy was observed. Doping near contact layer of branches of thermoelements lowered transitional contact while raising the efficiency of thermoelements.