Magnetothermoelectrical and adhesive properties of commutation contacts of thermoelements on the basis of extruded samples of Bi85Sb15 solid solution

Tağıyev M.

17th International Conference on Photoelectronics and Night Vision Devices, Moscow, Russia, 27 - 31 May 2002, vol.5126, pp.492-494, (Full Text) identifier

  • Nəşrin Növü: Conference Paper / Full Text
  • Cild: 5126
  • Çap olunduğu şəhər: Moscow
  • Ölkə: Russia
  • Səhifə sayı: pp.492-494
  • Açar sözlər: Adhesion, Alloy, Contacts, Diffusion, Extrusion, Resistance, Solid solution, Thermoelement, Wetting
  • Adres: Bəli

Qısa məlumat

A study of electrical and adhesive properties of transient contacts for extruded samples of Bi85Sb15 solid solutions have been conducted with alloys: 25Bi + 50Pb + 12.5Cd + 12.5Sn with Tm = 343 K (Wood's alloy) and 57Bi + 45Sn with Tm = 412 K in temperature range ∼77-300 K and magnetic field intensity (H) up to ∼74×104 A/m. It is shown, that resistance of transient contacts (rk) of the extruded of Bi85Sb15 solid solution with the specified contact alloys at ∼77Κ is determined by the resistance of the structure the solid solution Bi85Sb15-solid solution Bi85Sb15, heavily doped by Pb and Sn atoms, diffused from contact alloy into near-contact area of the Bi85Sb15 solid solution. It is established, that by doping extruded samples of Bi85Sb15 solid solution with Pb atoms it is possible to achieve reduction of a transient contact resistance rk in Bi85Sb15 solid solution - contact alloy interface.