Modern Physics Letters B, vol.37, no.24, 2023 (SCI-Expanded, Scopus)
The regularities of the formation of thin Mn/Si (111) nanofilms during solid-phase deposition of Mn on Si under conditions of ultrahigh vacuum (P=10-7Pa) and thin Mn4Si7/Si (111) nanofilms during annealing of the Mn/Si system have been studied. It has been established that silicon atoms diffuse into the Mn film up to a thickness of Θ=10-12 monolayers, and Mn in Si up to Θ=8-10 monolayers, therefore, a transition layer of nonstoichiometric MnxSiy silicide is formed at the Mn-Si interface. After heating at T=1050K, the higher manganese silicide (HMS) Mn4Si7 is formed. In particular, it was found that the bandgap of Mn4Si7 is Eg≈0.72eV, and the electron affinity is χ≈3eV and in the work, the optimal thermal diffusion conditions for the formation of stoichiometric Mn4Si7 silicide are determined. It is shown that at T≤1000K, a partial formation of a chemical bond between manganese and silicon atoms occurs. At 1100K, a thin Mn4Si7 film with a good stoichiometric composition is formed.